Metallized Semiconductor Die for Long Wire Interconnect

Wire width planning for interconnect performance optimization

In this paper, we study wire width planning for interconnect performance optimization in an interconnect-centric design flow. We first propose some simplified, yet near-optimal wire sizing schemes, using only one or two discrete wire widths. Our sensitivity study on wire sizing optimization further suggests that there exists a small set of “globally” optimal wire widths for a range of interconn...

Semiconductor Die Bonding

Adhesive die attach materials are suspensions of metal particles in a carrier. The particles are several μm in size, usually in the form of thin flakes of silver. The carrier provides adhesion and cohesion to make a bond with the correct mechanical strength, while the metal particles provide electrical and thermal conductivity. It is noticeable that conductive resins are now often used where no...

Optimum Wire Shaping of an Interconnect

The optimum wire shape for minimum signal propagation delay across an line is shown to have a general exponential form. The line inductance makes exponential tapering more attractive for lines than for lines. For lines, optimum wire tapering achieves a higher reduction in the signal propagation delay as compared to uniform wire sizing. Wire tapering can reduce both the propagation delay and pow...

Advanced Lithography: Nanoimprint Lithography for Semiconductor and Interconnect Technologies

Circuit Design , Transistor Sizing and Wire Layout of FPGA Interconnect

This paper examines the electrical design of FPGA interconnect circuitry. We explore the circuit design of pass transistor and tri-state buffer routing switches, determine which transistor sizing, metal width and metal spacing are best for FPGA interconnect, and show that FPGA interconnect should be electrically heterogeneous-some (~20%) of the routing tracks should be designed for maximum spee...